專任師資

Associate Professor Tian-Li Wu

Office: ED536
TEL: 886-3-5712121#59442
E-mail: tlwu@nycu.edu.tw
Lab website:
https://tianliwu.wixsite.com/nycuwlab

GaN/SiC/GaO for power/B5G&6G applications
Sub-5 nm beyond CMOS
Reliability evaluation and degradation mechanism analysis
AI-assisted device design and reliability predictions

Education:
2011-2016 Ph.D., Electrical Engineering, KU Leuven, Belgium 
2014 Business Strategy & Consulting, Imperial College Business school, UK

Professional Experience: 
2024.08 – present Associate Professor, Institute of Electronics, NYCU
2024.07 – present IEEE EDS Technical Committees on Electronic Materials
2023.08 – present Editor, Scientific Reports (Nature Journal)
2023.01 – present IEEE EDS Technical Committees on Compound Semiconductor Devices & Circuits
2023.01 – present IEEE EDS Technical Committees on Compact Modeling
2023.01 – present Distinguished Research Fellow, Industrial Technology Research Institute
2022.08 – present Joint Professor, Undergraduate Program of Nano science and Engineering, NYCU
2022.02 – present Joint Professor, Industrial Academy Innovation School, NYCU 2021.10 – present Executive Director, MOST "Next-generation compound semiconductor technologies"
2021.11 – present Trustee, Taiwan ESD Association 
2021.08 – present Associate Professor, International College of Semiconductor Technology, NYCU 
2017.08 – present MediaTek Junior Chair Professor 
2022.08 – 2023.02 Vice Dean, International College of Semiconductor Technology, NYCU
2021.02 – 2021.07 Assistant Professor, International College of Semiconductor Technology, NYCU
2017.02 – 2021.01 Assistant Professor, International College of Semiconductor Technology, NCTU
2016.08 – 2017.01 Research Scientist, Imec, Leuven, Belgium. 
2011.09 – 2016.07 Ph.D. researcher, Imec, Leuven, Belgium.
2016.01 – 2016.03 Visiting researcher, IBM, NY, USA.

Honors and Awards：
2023 CIEE Outstanding Young Electrical Engineer 
2023 NSTC Ta-You Wu Memorial Award 
2023 NSTC Excellent Young Scholars Project Award 
2022 Outstanding Young Researcher, Taiwan Electronics Device and Materials Association (EDMA)
2022 NYCU Excellent Teaching Award 
2021 Taiwan Semiconductor Industry Association (TSIA) Semiconductor Award 
2020 Outstanding Master Thesis Award, Taiwan Inst. of Electrical and Electronic Eng. (TIEEE)
2020 NCTU outstanding graduate mentorship award 
2020 Fellow of the Higher Education Academy (FHEA), Advanced HE
2019 Featured case for MOE Taiwan Education Experience Program (TEEP)
2019 2019 MOST Young Scholar Fellowship
2017 MediaTek Junior Chair Professor 
2015 Fellowship for long stay abroad research, FWO
2012 Imec Ph.D. Fellowship
2011 Imec Predoctoral scholarship

Biography:
     Prof. Tian-Li Wu (HEA Fellow) received the Ph.D. degree in electrical engineering from KU Leuven, Belgium, in 2016. From 2011 to 2017, He was with the GaN power device group at imec, Leuven, Belgium, where he focused on research and development of CMOS compatible 200-mm GaN-on-Si platform for power switching applications and investigation of reliability issues in GaN power devices. In 2016, he visited IBM, New York, NY, USA, where he focused on interface characterization in sub-10nm SiGe pMOS FinFETs. He is currently the Associate Professor with Institute of Electronics at National Yang Ming Chiao Tung University, Hsinchu, Taiwan, and the Joint Professor with International College of Semiconductor Technology (ICST) and Industry Academia Innovation School (IAIS) at National Yang Ming Chiao Tung University, Hsinchu, Taiwan,. He was named the MediaTek Junior Chair Professor in 2017.
     He was the recipient of the Semiconductor Award from the TSIA in 2021, Fellow of the Higher Education Academy (HEA Fellow) in 2020, MOST Young Scholar Fellowship in 2019, MediaTek Junior Chair Professorship in 2017, the Fellowship for long term abroad research from FWO (Flanders Research Foundation) in 2015, and imec Ph.D. Fellowship in 2012. 
     He authored and coauthored more than 100 publications in peer reviewed journals or conferences. His research interests focus on 1) GaN/SiC/GaO Power semiconductor and electronics, 2) Advanced sub-5nm logic devices, and 3) reliability evaluation and degradation analysis, and 4) AI-assisted device design and reliability predictions.