系所成員

黃柏蒼(Po-Tsang Huang) 副教授

黃柏蒼(Po-Tsang Huang) 

Office: 工程四館534室(ED534)
TEL: 03-5712121 #54145
E-mail: bughuang@nycu.edu.tw

永續導向晶片電路與架構實驗室
Sustainable Circuits and Architectures for Layered Eco-chips Lab (SCALE Lab)
網頁:https://sites.google.com/site/nctueecslab/ 

學歷
2004 – 2010 國立交通大學電子所 博士
2002 – 2004 國立交通大學電子所 碩士
1997 – 2002 國立交通大學電子工程學系 學士

經歷
2022.12 – 2025.08 國立陽明交通大學國際半導體產業學院副教授
2017.02 – 2022.12 國立交通大學國際半導體產業學院助理教授
2014.11 – 2016.11 Visiting Postdoctoral Scholar, Electrical Engineering Department, UCLA
2015.10 – 2017.01 Associate Research Fellow, Department of Electrical and Computer Engineering, NCTU
2014.01 – 2015.10 Assistant Research Fellow, Department of Electrical and Computer Engineering, NCTU
2011.01 – 2013.12 Assistant Research Fellow, Department of Electronics Engineering, NCTU

研究方向
數位積體電路設計、三維積體電路設計、記憶體電路設計、系統晶片設計、前瞻製程電路設計方法

Research Interests:
     Our major research goal for the next decade is to explore pioneering “sustainable circuits and systems”, focusing on carbon-aware system-design-technology co-optimization, carbon-aware computing, energy-efficient design techniques and methodologies of system integration for both power-limited and energy-limited applications. Our research spans across multiple levels of design abstraction from solid-state circuits, architectures and systems.

  • SoC/SiP architecture/platform for IoT, AI & communication applications
  • Carbon-aware system-design-technology co-optimization
  • Accelerator design for neural networks using 3D-SRAM or 3D-DRAM
  • Hierarchical configurable interconnect with 3D-SRAM for memory-centric computingW
  • Fault-tolerant 3D-DRAM controller
  • Memory sub-system for heterogeneous multi-core SoC/SiP
  • Accelerator-rich and memory-rich computer architectures for domain-specific computing
  • System-level power analysis and noise reduction in HPC/3DIC
  • Accelerator/reconfigurable architecture for SDR or resilient wireless network
  • Circuit/technology co-design using monolithic/TSV 3DIC, emerging memory & devices
  • Low-power high-density embedded memory design and diagnosis methodology (SRAM, Register-File, FIFO, CAM/TCAM)
  • Computation-in-memory or in-memory searching engine for neural networks (SRAM, ReRAM, FeFET, FeRAM)
  • Fault/Age-Aware Memory Design
  • Energy-Efficient digital IC (VLSI) design using emerging memory & devices
  • Power management and data communications for 3D-IC (M3D & TSV 3D-IC)
  • Ultra-low voltage IC design for IoT and biomedical applications